MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components
Електронного архіву Харківського національного університету радіоелектроніки (Open Access Repository of KHNURE)
Переглянути архів Інформація| Поле | Співвідношення | |
| Creator |
Nevliudov, I. Sh.
Palagin, V. A. Razumov-Frizjuk, E. A. Zharikova, I. V. |
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| Date |
2014-12-09T21:06:26Z
2014-12-09T21:06:26Z 2012-09-14 |
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| Identifier |
Nevliudov, I.Sh. MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components [Text] / I. Sh. Nevliudov, V. A. Palagin, E. A. Razumov-Frizjuk, I. V. Zharikova // Proceedings of IEEE East-West Design & Test Symposium (EWDTS’2012), September 14-17, 2012, Kharkov, Ukraine. – РР. 483-485.
http://hdl.handle.net/123456789/1713 |
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| Description |
The aim of this paper is to introduce a new method of multilayer commutative boards (printed, thick or thin film) and BGA components testing. Four types of test fixtures for connecting some thousands test points on unit under test to automatic test equipment are presented. Probes in proposed MEMS devices fulfilled as ball grid arrays on flexible film with aluminum microwires. Such test fixtures give opportunity for self-monitoring contact of each probe to test point on board. The simplified devices can be used for BGA components testing before soldering in electronic modules. |
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| Language |
en
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| Publisher |
KHARKOV NATIONAL UNIVERSITY OF RADIOELECTRONICS
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| Subject |
Multilayer commutative boards
BGA/CSP components electrical testing test fixture multiprobes contacting device MEMS |
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| Title |
MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components
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| Type |
Article
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